Re: Does the bonding driver honour dev->features of slave devices
From: Tomar, Nagendra (nagendra_tomar@adaptec.com)
Date: Thu Sep 11 2003 - 03:45:52 EST
On Wed, 10 Sep 2003, Tomar, Nagendra wrote:
> Hello All,
> I am going throgh the "Link Aggregation" module in Linux
> (bonding.c). The code seems to suggest that the dev->features of slave
> devices is simply ignored while bundling into the master device. Suppose
> I
> have two Intel epro1000 cards that can support TCP Segmentation Offload.
>
> Now if I bond these two slave cards into a new master card, the new
> bonding device that is the master device will be used in the routing
> table. When a TCP connection is established sk->route_caps is assigned
> from the dev->features of the assigned outgoing device. If the outgoing
> device is the bonding device then the dev->features won't have
> NETIF_F_TSO
> as the feature and hence upper layers will believe that the outgoing
> device cannot do TSO.
> I believe that at best we can take an OR of the dev->features of all the
Sorry, I mean AND ..
>
> slave devices and assign it to the dev->features of the bonding device.
> This way we are sure that we are taking the Least Common Denominator
> while
> deciding the features for the master device.
>
> Thanx,
> tomar
>
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